The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2026

Filed:

May. 27, 2021
Applicant:

Nitto Denko Corporation, Osaka, JP;

Inventors:

Daigo Tsubai, Osaka, JP;

Naoki Shibata, Osaka, JP;

Hiroaki Machitani, Osaka, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/05 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/05 (2013.01); H05K 1/11 (2013.01);
Abstract

A wiring circuit board includes a metal support substrate, an insulating layer, and a conductive layer in this order in a thickness direction, and has an edge portion extending in a first direction. The edge portion includes a main structure portion and partially includes a partial structure portion. In the main structure portion, the metal support substrate has a substrate extension portion extending outwardly with respect to the insulating layer in a second direction perpendicular to the first direction and the thickness direction. In the partial structure portion, the insulating layer has an insulating layer extension portion extending outwardly with respect to the metal support substrate in the second direction.


Find Patent Forward Citations

Tsubai, Daigo. (2026). Wiring circuit board (U.S. Patent No. 12575028). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12575028

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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