The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 21, 2023

Filed:

Mar. 05, 2020
Applicant:

Nitto Denko Corporation, Osaka, JP;

Inventors:

Ryosuke Sasaoka, Osaka, JP;

Yasunari Oyabu, Osaka, JP;

Hiroaki Machitani, Osaka, JP;

Hayato Takakura, Osaka, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0266 (2013.01); H05K 3/0017 (2013.01);
Abstract

A wiring circuit board includes an alignment mark layer. The alignment mark layer includes a first alignment mark and a second alignment mark. The condition A or the condition B is satisfied. Condition A: The first alignment mark has a first portion (a first starting point portion or a first center of gravity portion). The second alignment mark has a second portion (a second starting point portion or a second center of gravity portion). Condition B: The first alignment mark has the first portion, and the second alignment mark does not have the second portion, or the first alignment mark does not have the first portion, and the second alignment mark does not have the second portion.


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