Annaka, Japan

Hiroaki Kizaki



Average Co-Inventor Count = 4.1

ph-index = 7

Forward Citations = 163(Granted Patents)


Location History:

  • Usui-gun, JP (1999 - 2000)
  • Gunma-ken, JP (1999 - 2000)
  • Annaka, JP (1995 - 2017)

Company Filing History:


Years Active: 1995-2017

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11 patents (USPTO):Explore Patents

Title: Innovations of Hiroaki Kizaki

Introduction

Hiroaki Kizaki is a prominent inventor based in Annaka, Japan. He has made significant contributions to the field of heat conductive materials, holding a total of 11 patents. His work focuses on developing innovative silicone compositions that enhance thermal management in electronic devices.

Latest Patents

Kizaki's latest patents include a heat conductive silicone composition designed to improve heat dissipation between electronic components. This composition features a unique combination of organopolysiloxane, hydrolyzable dimethylpolysiloxane, heat conductive fillers, and organohydrogenpolysiloxanes. The formulation ensures that the cured object maintains appropriate storage and loss modulus, preventing peeling and pump-out during thermal cycles. Another notable patent is a thermally conductive grease composition that minimizes hardness increase during high-temperature heating, ensuring reliable performance in demanding applications.

Career Highlights

Hiroaki Kizaki has spent a significant part of his career at Shin-Etsu Chemical Co., Ltd., where he has been instrumental in advancing thermal management technologies. His innovative approaches have led to the development of materials that are essential for modern electronic devices, contributing to improved efficiency and reliability.

Collaborations

Kizaki has collaborated with notable colleagues such as Masaaki Yamaya and Kunihiro Yamada. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Hiroaki Kizaki's contributions to the field of heat conductive materials have made a lasting impact on the electronics industry. His innovative patents and collaborative efforts continue to drive advancements in thermal management solutions.

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