Shin-etsu Chemical Co., Ltd.

Hiroaki Kizaki

Masaaki Yamaya

Kunihiro Yamada

Masahiro Furuya

Akira Yamamoto

Nobuaki Matsumoto

Kenichi Tsuji

Akihiro Endo

Kunio Itoh

Toshio Shinohara

Kei Miyoshi

Akinari Itagaki

Kazuharu Sato

Akio Nakano

Kunihiko Mita

Hiroaki Tetsuka

Yukinori Satou

Shoichi Tanaka

Kazunobu Umemura

Provided is a heat conductive silicone composition disposed between a heat generating electronic component and a member for dispersing heat, wherein the heat conductive silicone composition contains (A) an organopolysiloxane having at least two alkenyl groups in one molecule and having a dynamic viscosity at 25&#xb0; C. of 10 to 100,000 mm/s, (B) a hydrolyzable dimethylpolysiloxane having three functional groups at one end expressed by formula (1), (C) a heat conductive filler having a heat conductivity of 10 W/m&#xb0; C. or higher, (D) an organohydrogenpolysiloxane expressed by formula (2), (E) an organohydrogenpolysiloxane containing a hydrogen directly bonded to at least two silicon atoms in one molecule other than component (D), and (F) a catalyst selected from the group consisting of platinum and platinum compounds. The heat conductive silicone composition provides a cured object having a storage modulus, loss modulus, and coefficient of loss within appropriate ranges; peeling and pump out during heating/cooling cycle tending not to occur, and increases in thermal resistance being suppressed.

Heat conductive silicone composition based on combination of components, heat conductive layer, and semiconductor device

The present invention provides a thermally conductive grease composition which scarcely increases in hardness during high-temperature heating and has a minimized reduction in growth, containing: (Ris a Calkyl group, and a is an integer 5 to 100);

Thermally conductive silicone grease composition

A thermally conductive silicone grease composition comprising: wherein Rrepresents an alkyl group having 1 to 6 carbon atoms and b is an integer of 5 to 100;

Provided is a heat conductive silicone grease composition, including: (A) 100 parts by volume of an organopolysiloxane with a specific structure and with a kinematic viscosity at 25&#xb0; C. of 10 to 10,000 mm/s, (B) 0.1 to 50 parts by volume of an alkoxysilane with a specific structure, and (C) 100 to 2,500 parts by volume of a heat conductive filler. The composition exhibits high thermal conductivity, retains excellent fluidity meaning the composition exhibits favorable workability, and is capable of filling fine indentations, thereby reducing contact resistance and providing excellent heat radiation performance. Also, the durability, under conditions of high temperature and high humidity, of the composition is improved, thereby improving the reliability of the composition during actual use. Heat generated by a heat-generating body can be dissipated into a heat-radiating body by sandwiching the composition between the heat-generating body and the heat-radiating body.

Heat conductive silicone grease compositions

Provided is a curable organopolysiloxane composition which includes (A) an organopolysiloxane containing at least 2 alkenyl groups bonded to silicon atoms within each molecule, (B) an organohydrogenpolysiloxane containing at least 2 hydrogen atoms bonded to silicon atoms within each molecule, (C) gallium and/or an alloy thereof, with a melting point within a range from 0 to 70&#xb0; C., optionally (D) a heat conductive filler with an average particle size within a range from 0.1 to 100 &#x3bc;m, (E) a platinum based catalyst, and (F) an addition reaction control agent. The composition is useful as a material capable of forming a layer with excellent thermal conductivity that is sandwiched between a heat generating electronic component and a heat radiating member.

Curable organopolysiloxane composition and semiconductor device

A polyorganosiloxane compound obtained by allowing a polyorganosiloxane having silicone resin structure to react with a polyorganosiloxane having silicone oil structure in the presence of a hydrosilylation catalyst, and having the both structures in the molecule. Also disclosed is a coating composition including the polyorganosiloxane compound, a silane or silicone resin having an RO&mdash;Si group, and a curing catalyst. The former polyorganosiloxane compound is compatible with silicone resins. The latter coating composition can provide coatings improved in flexibility without lowering the curability, surface hardness and weatherability inherent in silicone resins.

Polyorganosiloxane compound and coating composition containing the same

A silicone resin-containing emulsion composition is based on a silicone resin-containing emulsion obtained by emulsion polymerization of a mixture containing (A) a silanol group-bearing silicone resin and (B) a radical-polymerizable vinyl monomer. The silicone resin (A) contains 30-100 mol % of T units: R.sup.1 --SiZ.sub.3, and specifically 30-80 mol % of T-2 units: R.sup.1 --Si(OH)Z'.sub.2 among other T units wherein R.sup.1 is a monovalent hydrocarbon group, Z is a OH group, hydrolyzable group or siloxane residue, and Z' is a siloxane residue, and has a number average molecular weight of at least 500. The composition has a good film forming ability and cures into a flexible film having mar, weather and chemical resistance.

Silicone resin-containing emulsion composition, making method, and

A silicone resin-containing emulsion composition is prepared by emulsion polymerizing a solution containing a water-insoluble silanol group-bearing silicone resin and a radical polymerizable vinyl monomer and substantially free of an organic solvent. The emulsion may further contain a film-forming assistant having a boiling point of at least 100.degree. C. and soluble or uniformly dispersible in water. The emulsion can be coated and cured into a film having mar resistance, weather resistance, and chemical resistance.

Silicone resin-containing emulsion composition, method for making same,

A coating agent composition comprising an organopolysiloxane resin: with the organopolysiloxane resin having a number average molecular weight of at least 500 and acrylic or methacrylic functional group-attached silicon atoms in a proportion of 5 to 100 mole % to the total silicon atoms; and with the resin comprising units represented by formula R.sup.1 LSiX.sub.3 in a proportion of 30 to 100 mole %, wherein R.sup.1 is a hydrogen atom or a substituted or unsubstituted organic group having 1 to 18 carbon atoms and X is a hydroxyl group, a hydrolyzable group or a siloxane residue, provided that at least one X is a siloxane residue; wherein from 30 to 80 mole % of the R.sup.1 SiX.sub.3 units are one silanol group-containing units represented by formula R.sup.1 Si(OH)Y.sub.2 wherein Y is a siloxane residue.

Coating agent composition and articles treated with said composition

Disclosed is a method of producing dimethylpolysiloxanes through hydrolysis of dimethyldichlorosilane wherein a water solution containing a water-soluble oxygen-containing organic compound is introduced into dimethyldichlorosilane. Therein, linear dimethylpolysiloxanes alone having both ends blocked with chlorine atoms can be selectively produced by properly controlling the water content in the hydrolysis system and further by rendering the hydrolysis system acidic, and cyclic dimethylpolysiloxanes alone can also be selectively produced by properly controlling the water content in the hydrolysis system and optionally rendering the hydrolysis system acidic.

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Annaka, Japan

Hiroaki Kizaki