The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2006
Filed:
Oct. 06, 2004
Akihiro Endo, Annaka, JP;
Kunihiko Mita, Annaka, JP;
Akio Nakano, Annaka, JP;
Kunihiro Yamada, Takasaki, JP;
Hiroaki Kizaki, Annaka, JP;
Hiroaki Tetsuka, Saitama, JP;
Akihiro Endo, Annaka, JP;
Kunihiko Mita, Annaka, JP;
Akio Nakano, Annaka, JP;
Kunihiro Yamada, Takasaki, JP;
Hiroaki Kizaki, Annaka, JP;
Hiroaki Tetsuka, Saitama, JP;
Shin-Etsu Chemical Co., Ltd., Tokyo, JP;
Abstract
Provided is a curable organopolysiloxane composition which includes (A) an organopolysiloxane containing at least 2 alkenyl groups bonded to silicon atoms within each molecule, (B) an organohydrogenpolysiloxane containing at least 2 hydrogen atoms bonded to silicon atoms within each molecule, (C) gallium and/or an alloy thereof, with a melting point within a range from 0 to 70° C., optionally (D) a heat conductive filler with an average particle size within a range from 0.1 to 100 μm, (E) a platinum based catalyst, and (F) an addition reaction control agent. The composition is useful as a material capable of forming a layer with excellent thermal conductivity that is sandwiched between a heat generating electronic component and a heat radiating member.