Mechanicville, NY, United States of America

Himani Suhag Kamineni

This inventor holds 3 USPTO granted patents. Top assignee: Globalfoundries Inc.. Active years: 2015-2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Himani Suhag Kamineni. Retrieved from https://idiyas.com/inventor/himani-suhag-kamineni

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 66.7

Average Co-Inventor Count = 3.6

ph-index = 2

Forward Citations = 5(Granted Patents)


Location History:

  • Albany, NY (US) (2015)
  • Mechanicville, NY (US) (2018 - 2019)

Company Filing History:


Years Active: 2015-2019

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3 patents (USPTO):Explore Patents

Title: **Innovations by Himani Suhag Kamineni: Pioneering Advances in Integrated Circuits**

Introduction

Himani Suhag Kamineni, an inventive force located in Mechanicville, NY, is making notable strides in the realm of semiconductor technology. With a remarkable portfolio of three patents, she is known for her significant contributions to the development of integrated circuit products.

Latest Patents

Himani has recently unveiled her latest patent focusing on an innovative integrated circuit product featuring a through-substrate-via (TSV) and a specialized metallization layer, which are formed after the semiconductor device creation. This sophisticated design includes a substrate and interlayer dielectric (ILD) material, with a TSV that extends seamlessly through both layers. Importantly, an insulating liner layer is strategically positioned to ensure optimal separation between the substrate portion and the underlying substrate while only partially extending into the ILD material.

Additionally, she has patented methods for forming a TSV and metallization layer post-semiconductor device fabrication. This method is crucial as it details the formation of a device level contact followed by common process operations to achieve the creation of a TSV structure and a conductively linked metallization element.

Career Highlights

Himani Suhag Kamineni currently contributes her expertise at GlobalFoundries Inc., a company renowned for its leadership in semiconductor manufacturing. Her work primarily revolves around innovative semiconductor solutions, underscoring her role in advancing technology that is crucial for modern electronics.

Collaborations

In her professional journey, she collaborates with colleagues such as Vimal Kumar Kamineni and Daniel P. Smith, fostering an environment of teamwork that enhances the innovation pipeline at GlobalFoundries Inc. Their combined efforts play a pivotal role in driving the company's mission to achieve excellence in semiconductor technologies.

Conclusion

Himani Suhag Kamineni stands as a prominent inventor in the semiconductor field, pushing the boundaries of integrated circuit designs with her innovative patents. Her work not only advances technological capabilities but also sets a high bar for future developments in the industry. As she continues to innovate, the impact of her contributions is likely to resonate through the evolving landscape of electronic devices and systems.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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