Company Filing History:
6 out of 7,529 
3 out of 3,781 
Years Active: 2006-2017
Title: The Innovations of Hikaru Ikegami
Introduction
Hikaru Ikegami is a prominent inventor based in Koganei, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 9 patents. His work has been instrumental in advancing multi-chip module designs and manufacturing methods.
Latest Patents
One of Ikegami's latest patents involves a semiconductor device and its manufacturing method. This innovation features three chips (A), (B), and (C) mounted on a main surface of a package substrate in a multi-chip module (MCM). Chip (A) contains a DRAM, while chip (B) includes a flash memory. These chips are electrically connected to the wiring lines of the package substrate through Au bumps. Additionally, a gap between the main surfaces of chips (A) and (B) and the package substrate is filled with an under-fill resin. Chip (C), which houses a high-speed microprocessor, is mounted over chips (A) and (B) and is connected to the bonding pads of the package substrate via Au wires.
Career Highlights
Ikegami has worked with notable companies in the semiconductor industry, including Renesas Electronics Corporation and Renesas Technology Corporation. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking technologies.
Collaborations
Throughout his career, Ikegami has collaborated with talented individuals such as Yoshiyuki Kado and Takahiro Naito. These partnerships have fostered innovation and creativity in his projects.
Conclusion
Hikaru Ikegami's contributions to semiconductor technology and his impressive portfolio of patents highlight his role as a leading inventor in the field. His work continues to influence advancements in multi-chip module designs and manufacturing methods.