The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2017
Filed:
Dec. 24, 2014
Renesas Electronics Corporation, Kawasaki-shi, JP;
Yoshiyuki Kado, Kodaira, JP;
Takahiro Naito, Kodaira, JP;
Toshihiko Sato, Kodaira, JP;
Hikaru Ikegami, Koganei, JP;
Takafumi Kikuchi, Higashiyamato, JP;
Renesas Electronics Corporation, Tokyo, JP;
Abstract
Of three chips (A), (B), and (C) mounted on a main surface of a package substrate () in a multi-chip module (MCM), a chip (A) with a DRAM formed thereon and a chip (B) with a flash memory formed thereon are electrically connected to wiring lines () of the package substrate () through Au bumps (), and a gap formed between main surfaces (lower surfaces) of the chips (A), (B) and a main surface of the package substrate () is filled with an under-fill resin (). A chip (C) with a high-speed microprocessor formed thereon is mounted over the two chips (A) and (B) and is electrically connected to bonding pads () of the package substrate () through Au wires ().