Renesas Electronics Corporation

Renesas Technology Corp.

Hikaru Ikegami

Takahiro Naito

Takafumi Kikuchi

Toshihiko Sato

Yoshiyuki Kado

Motoo Suwa

Takafumi Betsui

Of three chips (A), (B), and (C) mounted on a main surface of a package substrate () in a multi-chip module (MCM), a chip (A) with a DRAM formed thereon and a chip (B) with a flash memory formed thereon are electrically connected to wiring lines () of the package substrate () through Au bumps (), and a gap formed between main surfaces (lower surfaces) of the chips (A), (B) and a main surface of the package substrate () is filled with an under-fill resin (). A chip (C) with a high-speed microprocessor formed thereon is mounted over the two chips (A) and (B) and is electrically connected to bonding pads () of the package substrate () through Au wires ().

Semiconductor device and manufacturing method thereof

Method of manufacturing semiconductor device

A mounting board has a plurality of semiconductor memory devices operated in sync with a clock signal, and a semiconductor data processing device which access-controls the semiconductor memory devices. Layouts of data-system terminals of the semiconductor memory devices with respect to memory access terminals of the semiconductor data processing device are determined in such a manner that wirings for data and a data strobe system (RTdq/dqs) become shorter than wirings for a command/address system (RTcmd/add). The wirings for the data and data strobe system (RTdq/dqs) are laid down using an area defined between the semiconductor memory devices. The wirings for the command/address system (RTcmd/add) bypass the side of the mounting board.

Semiconductor device

Growing community of inventors

Koganei, Japan

Hikaru Ikegami