Company Filing History:
Years Active: 2019-2024
Title: Hien Ly: Innovator in Flexible Circuit Technology
Introduction
Hien Ly is a notable inventor based in St. Petersburg, FL (US). He has made significant contributions to the field of flexible circuit technology, holding a total of 6 patents. His innovative approaches have paved the way for advancements in electronic connectivity.
Latest Patents
One of Hien Ly's latest patents is a method and apparatus for flexible circuit cable attachment. This invention describes a process where gold bumps are bonded on interconnection pads of a substrate to create a columnar structure. Solder or conductive epoxy is then dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or the placement of a weight. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, which reduces the risk of bridging due to the columnar structure. Additionally, a nonconductive underfill epoxy is applied to increase mechanical strength.
Career Highlights
Hien Ly has been instrumental in developing innovative solutions at Jabil Inc. His work has significantly impacted the efficiency and reliability of flexible circuit connections in various applications. His expertise in this area has established him as a key figure in the industry.
Collaborations
Hien has collaborated with talented individuals such as Wenlu Wang and Mark A Tudman. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.
Conclusion
Hien Ly's contributions to flexible circuit technology exemplify his dedication to innovation and excellence. His patents and collaborative efforts continue to influence the field, making him a prominent inventor in the industry.