Jabil Inc.

Hien Ly

Mark A Tudman

Wenlu Wang

Ross Kristensen Benz

Gary Fang

Michael Piring Santos

Vincy Wan Sze Li

Corey Matthew Smith

Wieslaw Mariusz Januszko

Jennifer Lindsey Gamboa

A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.

Method and apparatus for flexible circuit cable attachment

A method of identifying opposing ends of a cable within a cabling assembly having a plurality of cables. The method includes transmitting a signal to a first end of a cable of the plurality of cables, receiving the signal at a second end of the cable of the plurality of cables, transmitting an output signal from a connector operably coupled to the second end of the cable of the plurality of cables to a processor. The connector is one of a plurality of connectors. The method additionally includes identifying using an indicator device the connector of the plurality of connectors that is operably coupled to the second end of the cable.

Cable identification tester

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St. Petersburg, FL, United States of America

Hien Ly