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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10448517 B1

PDFFull Text
Date of Patent:
Oct. 15, 2019

Filed:

Nov. 04, 2016

Method and apparatus for flexible circuit cable attachment

Applicant:

Jabil Inc., St. Petersburg, FL (US);

Inventors:

Wenlu Wang, St. Petersburg, FL (US);

Mark A. Tudman, St. Petersburg, FL (US);

Michael Piring Santos, St. Petersburg, FL (US);

Ross Kristensen Benz, St. Petersburg, FL (US);

Hien Ly, St. Petersburg, FL (US);

Gary Fang, St. Petersburg, FL (US);

Assignee:

Jabil Inc., St. Petersburg, FL (US);

Attorney:

Young Basile Hanlon & MacFarlane, P.C.

Primary Examiner:

Scott W Dodds

Int. Cl.
CPC ...
H05K 3/36 (2006.01); H05K 3/34 (2006.01); B23K 20/00 (2006.01); B23K 20/24 (2006.01); B23K 35/02 (2006.01); B23K 35/30 (2006.01); H05K 1/11 (2006.01); H05K 3/32 (2006.01); H05K 3/40 (2006.01); H05K 13/00 (2006.01); B23K 20/02 (2006.01); B23K 20/233 (2006.01); H01L 21/84 (2006.01); H01L 23/00 (2006.01); B23K 101/42 (2006.01); B23K 103/08 (2006.01);
U.S. Cl.
CPC ...
H05K 3/3494 (2013.01); B23K 20/007 (2013.01); B23K 20/025 (2013.01); B23K 20/233 (2013.01); B23K 20/24 (2013.01); B23K 35/0222 (2013.01); B23K 35/3013 (2013.01); H01L 21/84 (2013.01); H01L 24/80 (2013.01); H05K 1/111 (2013.01); H05K 1/117 (2013.01); H05K 3/321 (2013.01); H05K 3/361 (2013.01); H05K 3/363 (2013.01); H05K 3/4015 (2013.01); H05K 13/0015 (2013.01); B23K 2101/42 (2018.08); B23K 2103/08 (2018.08); H05K 2203/049 (2013.01); H05K 2203/166 (2013.01); Y02P 70/611 (2015.11);
Abstract

A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.

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