Hwaseong-si, South Korea

HieChul Kim

USPTO Granted Patents = 2 

Average Co-Inventor Count = 7.5

ph-index = 1


Company Filing History:


Years Active: 2023

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2 patents (USPTO):Explore Patents

Title: HieChul Kim: Innovator in Semiconductor Technology

Introduction

HieChul Kim is a prominent inventor based in Hwaseong-si, South Korea. He has made significant contributions to the field of semiconductor technology, particularly in methods for thin film formation. With a total of 2 patents, his work is recognized for its innovative approaches to substrate processing.

Latest Patents

HieChul Kim's latest patents include a "Thin film forming method" and a "Method for filling a gap in a three-dimensional structure on a semiconductor substrate." The thin film forming method involves a substrate processing technique that fills gaps without seams or voids. This method includes providing a substrate with a gap in a reaction chamber, pumping down the chamber to a pressure at or below 5 Torr, and filling the gap with a film by alternately supplying a precursor, a reactant, and radio frequency electromagnetic radiation. The second patent focuses on filling gaps in three-dimensional structures over semiconductor substrates. This method includes depositing a thin film on a three-dimensional structure using reaction gas activated with radio frequency power, followed by etching the deposited film to ensure the trench or hole is filled with a thin film that is free of voids and seams.

Career Highlights

HieChul Kim is currently associated with Asm IP Holding B.V., where he continues to advance his research and development in semiconductor technologies. His innovative methods have the potential to enhance the efficiency and reliability of semiconductor devices.

Collaborations

HieChul Kim has collaborated with notable colleagues, including SungKyu Kang and KiKang Kim. Their combined expertise contributes to the advancement of semiconductor technology and innovation.

Conclusion

HieChul Kim's contributions to semiconductor technology through his patents demonstrate his commitment to innovation in the field. His work not only addresses current challenges but also paves the way for future advancements in semiconductor manufacturing.

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