The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 21, 2023

Filed:

Mar. 30, 2021
Applicant:

Asm Ip Holding B.v., Almere, NL;

Inventors:

SungKyu Kang, Hwaseong-si, KR;

JongWan Choi, Hwaseong-si, KR;

YoungHoon Kim, Cheonan-si, KR;

HieChul Kim, Hwaseong-si, KR;

KyungEun Lee, Suwon-si, KR;

TaeHee Yoo, Bucheon-si, KR;

Assignee:

ASM IP Holding B.V., Almere, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01J 37/32 (2006.01); H01L 21/762 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32174 (2013.01); H01L 21/02274 (2013.01); H01L 21/02208 (2013.01); H01L 21/76224 (2013.01);
Abstract

A substrate processing method for filling a gap without seams or voids comprising: providing a substrate with a gap in a reaction chamber, pumping down the reaction chamber to a pressure at or below 5 Torr and filling the gap with a film by alternately and sequentially supplying a precursor, a reactant and a radio frequency electromagnetic radiation comprising a relatively high radio frequency component and a relatively low radio frequency component.


Find Patent Forward Citations

Kang, SungKyu. (2023). Thin film forming method (U.S. Patent No. 11823866). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11823866

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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