Hideyuki Suga

Title: The Innovations of Hideyuki Suga

Introduction

Hideyuki Suga is a notable inventor based in Hamura, Japan. He has made significant contributions to the field of semiconductor technology, holding three patents to his name. His work focuses on improving the fabrication methods of semiconductor integrated circuit devices.

Latest Patents

Suga's latest patents include a fabrication method of semiconductor integrated circuit devices. This innovative technique is capable of stably releasing chips from a dicing tape. The process involves grinding the back surface of a semiconductor wafer while adhering a pressure-sensitive adhesive tape to the circuit-forming surface. This method achieves a predetermined thickness and forcibly oxidizes the back surface of the semiconductor wafer. After releasing the pressure-sensitive adhesive tape, a dicing tape is adhered to the back surface. The semiconductor wafer is then diced into individual chips, and the back surface of each chip is pressed by the dicing tape, allowing for the stable release of the chips.

Career Highlights

Throughout his career, Hideyuki Suga has worked with prominent companies in the semiconductor industry, including Renesas Technology Corporation and Renesas Eastern Japan Semiconductor, Inc. His experience in these organizations has contributed to his expertise in semiconductor fabrication techniques.

Collaborations

Suga has collaborated with notable colleagues such as Chuichi Miyazaki and Yoshiyuki Abe. Their combined efforts have further advanced the field of semiconductor technology.

Conclusion

Hideyuki Suga's contributions to semiconductor technology through his innovative patents and collaborations highlight his importance in the field. His work continues to influence the development of efficient fabrication methods for integrated circuit devices.