Saitama, Japan

Hideo Machida

This inventor holds 2 USPTO granted patents. Top assignees: Chuo Meiban Mfg. Co., Ltd., Nippon Cmk Corp.. Active years: 1980-1989.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hideo Machida. Retrieved from https://idiyas.com/inventor/hideo-machida-lafkh9wc

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 1.7

ph-index = 2

Forward Citations = 23(Granted Patents)


Company Filing History:


Years Active: 1980-1989

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2 patents (USPTO):Explore Patents

Title: Hideo Machida: Innovator in Printed Circuit Board Technology

Introduction

Hideo Machida, an accomplished inventor based in Saitama, Japan, has made significant contributions to the field of printed circuit board (PCB) technology. With a portfolio that includes two patents, Machida's innovations focus on enhancing the functionality and efficiency of PCBs, showcasing his expertise in electrical engineering.

Latest Patents

Machida's latest patents include a unique approach to designing printed wiring boards. His first patent details a printed wiring board comprised of a dielectric base plate, where a circuit pattern is applied to at least one surface. This board features a specialized solder resist film that contains silicon and/or fluorine compounds, covering the base plate apart from the desired soldering areas. This innovative film possesses solder-repelling properties that prevent solder bridging across adjacent circuits, while also addressing the formation of dots on the film by incorporating flux accumulating portions such as recesses or through-holes.

The second patent highlights a method for attaching component leads to printed circuit base boards. This invention describes an insulating substrate with a thin electric circuit layer of conductive material. The layer is designed with drilled parts adjacent to component lead attaching land-forming portions, allowing for the creation of composite lead-inserting holes. These holes enable precise insertion of component leads, ensuring that the top ends of the leads can be soldered effectively to the land-forming portions of the electric circuit layer, enhancing assembly precision.

Career Highlights

Throughout his career, Hideo Machida has worked with notable companies including Nippon CMK Corporation and Chuo Meiban Mfg. Co., Ltd. His experiences in these organizations have contributed to his deep understanding of PCB design and manufacturing practices, empowering him to innovate within the industry.

Collaborations

Machida's professional journey has also involved collaborations with esteemed colleagues such as Shin Kawakami and Satoshi Haruyama. Working alongside these skilled individuals has enabled Machida to synthesize diverse ideas and approaches, driving advancements in PCB technology.

Conclusion

Hideo Machida's contributions to the field of printed circuit boards through his inventive patents represent a profound impact on the electronics industry. His work not only enhances the performance and reliability of PCBs but also paves the way for future innovations. As the demand for advanced electronic components continues to rise, Machida's advancements will undoubtedly play a critical role in shaping the future of circuit board technologies.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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