The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 1989
Filed:
Oct. 21, 1987
Hideo Machida, Saitama, JP;
Shin Kawakami, Saitama, JP;
Satoshi Haruyama, Saitama, JP;
Hirotaka Okonogi, Saitama, JP;
Katutomo Nikaido, Saitama, JP;
Norito Mukai, Saitama, JP;
Nippon CMK Corp., Saitama, JP;
Abstract
A printed wiring board includes a dielectric base plate, a circuit pattern at least on one surface of the base plate, and a solder resist film containing silicon series and/or fluorine series and covering the base plate except a desired soldering area of the circuit pattern. The solder resist film has solder repelling property to prevent bridging of solder across adjacent circuits. However, the solder repelling property apts to form dots on the solder resist film. Accordingly, at least one flux accumulating portion is formed on said one surface of the base plate to accumulate flux repelled by the solder resist film. The flux accumulating portion may be a recess and/or through-hole arranged on the surface of the solder resist film.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile