Hidenori Iida

Title: Hidenori Iida: Innovator in Electronic Component Shielding

Introduction

Hidenori Iida is a notable inventor based in Niigata, Japan. He has made significant contributions to the field of electronic component enclosures, particularly through his innovative shielding methods. His work focuses on enhancing the functionality and design of electronic components.

Latest Patents

Hidenori Iida holds a patent for a "Shield method for electronic component enclosure and shield material." The objective of this invention is to provide a shielding method and material that maintains flexibility while allowing for smaller and thinner electronic component enclosures. The process involves forming a conductive layer on a basic sheet and creating a shield sheet with a non-hardening adhesive layer. This design allows for the efficient attachment of the shield material to electronic component enclosures, ensuring electrical connectivity through a conductive adhesive.

Career Highlights

Throughout his career, Hidenori Iida has worked with prominent companies such as SMK Corporation and Namics Corporation. His experience in these organizations has contributed to his expertise in electronic component design and innovation.

Collaborations

Hidenori Iida has collaborated with notable colleagues, including Yoshikazu Ueno and Haruhiko Kondo. Their combined efforts have further advanced the field of electronic component shielding.

Conclusion

Hidenori Iida's innovative approach to electronic component enclosures has led to significant advancements in the industry. His patent reflects a commitment to improving the design and functionality of electronic devices.