The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2011
Filed:
Sep. 15, 2008
Yoshikazu Ueno, Ibaraki-ken, JP;
Haruhiko Kondo, Tokyo, JP;
Harumi Kano, Tokyo, JP;
Mitsuru Obo, Ibaraki-ken, JP;
Akito Yoshii, Niigata-ken, JP;
Masahiro Kitamura, Niigata-ken, JP;
Hidenori Iida, Niigata-ken, JP;
Shin Teraki, Niigata-ken, JP;
Yoshikazu Ueno, Ibaraki-ken, JP;
Haruhiko Kondo, Tokyo, JP;
Harumi Kano, Tokyo, JP;
Mitsuru Obo, Ibaraki-ken, JP;
Akito Yoshii, Niigata-ken, JP;
Masahiro Kitamura, Niigata-ken, JP;
Hidenori Iida, Niigata-ken, JP;
Shin Teraki, Niigata-ken, JP;
SMK Corporation, Tokyo, JP;
Namics Corporation, Niigata-ken, JP;
Abstract
The objective of the present invention is to provide a shield method and shield material enabling to hold a flexibility degree with an enclosure shape and to make electronic component enclosures small and thin types. The shield method for electronic component enclosures in the present invention comprises a process in which a conductive layer is formed at a basic sheet and a shield sheet forming a non-hardening adhesive layer at the counter face to the basic layer is punched out to fit in individual electronic component enclosures for forming the shield materials, a process in which the shield material is attached to said electronic component enclosure, and a process in which a conductive adhesive is formed between a ground electrode set at said electronic component enclosure and the conductive layer to connect electrically.