Hitachiota, Japan

Hideki Mukuno

This inventor holds 3 USPTO granted patents. Top assignee: Other. Active years: 2002-2004.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hideki Mukuno. Retrieved from https://idiyas.com/inventor/hideki-mukuno-bpl5gte5

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.7

ph-index = 3

Forward Citations = 28(Granted Patents)


Location History:

  • Hitachiota, JP (2003)
  • Hitachiohta, JP (2002 - 2004)

Company Filing History:

goldMedal3 out of 834,513 
Other
 patents

Years Active: 2002-2004

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3 patents (USPTO):Explore Patents

Title: Innovations by Inventor Hideki Mukuno

Introduction

Hideki Mukuno is a notable inventor based in Hitachiohta, Japan. He has made significant contributions to the field of electronics through his innovative designs and patents. With a total of 3 patents, Mukuno has focused on enhancing the efficiency and effectiveness of soldering processes in electronic manufacturing.

Latest Patents

One of Mukuno's latest patents is a soldering machine that utilizes lead-free solders. This machine is designed to uniformly heat printed circuit boards and the electronic parts to be mounted, ensuring that the components are soldered without thermal damage. The design includes a porous member with numerous holes positioned between a blower fan and a heater, which helps to create uniform pressure for the heated fluid. Additionally, a radiation plate is incorporated to facilitate the turbulent flow of heated fluid towards the heating target, effectively melting the solder.

Another significant patent is the bump forming method and apparatus. This invention features a mask with multiple holes aligned with electrode portions on the surface of an object to be processed. The design allows for the mounting of conductive particles onto the electrode portions. A table with holes is used to suck the object from the opposite side, while a hopper containing conductive particles ensures they do not adhere to one another. This innovative approach enhances the efficiency of the bump forming process.

Career Highlights

Throughout his career, Hideki Mukuno has demonstrated a commitment to advancing technology in the electronics sector. His inventions have not only improved manufacturing processes but have also contributed to the development of more sustainable practices in the industry.

Collaborations

Mukuno has collaborated with notable colleagues, including Kazumi Tashiro and Hideaki Arita. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Hideki Mukuno's contributions to the field of electronics through his patents reflect his dedication to innovation and improvement in manufacturing processes. His work continues to influence the industry, paving the way for future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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