Bump forming method and bump forming apparatus

Abstract

A mask has a plurality of holes formed at positions corresponding to positions of a plurality of electrode portions on one surface of an object to be processed to mount thereon conductive particles , and the plurality of holes are opposite to the plurality of electrode portions formed on the object to be processed. A table has a plurality of holes for sucking the object to be processed from the other surface of the object to be processed , and for sucking the particles through the plurality of holes in the mask so that the particles may be mounted on the electrode portions formed on the object to be processed . A hopper contains therein the plurality of conductive particles , prevents the plurality of conductive particles from adhering to each other, and has a slit portion for dropping the plurality of conductive particles by the self-weight. A slit portion in the hopper is moved, facing the upper surface of the mask with a gap between the slit portion and the upper surface of the mask larger than a diameter of the particle , and the hopper is arranged in the front side in the moving direction, and the unit is arranged in the rear side, and the particles not dropped into the holes of the mask being collected by the collecting unit