The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 13, 2004

Filed:

Mar. 15, 2002
Applicant:
Inventors:

Hideki Mukuno, Hitachiohta, JP;

Kazumi Tashiro, Hitachinaka, JP;

Hideaki Arita, Mito, JP;

Kiyoshi Kanai, Hitachinaka, JP;

Teruo Okano, Sayama, JP;

Fumihiro Yamashita, Nakano, JP;

Shoichirou Matsuhisa, Sayama, JP;

Hidekazu Imai, Sayama, JP;

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/00 ; F27B 5/00 ;
U.S. Cl.
CPC ...
B23K 1/00 ; F27B 5/00 ;
Abstract

A soldering machine using lead-free solders is provided which can uniformly heat a printed circuit board and electronic parts to be mounted thereon, and which can solder the electronic parts without thermally damaging them. A porous member having a number of holes formed therein is disposed between a blower fan and a heater for making uniform the pressure of a fluid. A radiation plate is disposed between the heater and a heating target for blowing the fluid having been heated by the heater to the heating target in the form of a turbulent flow. The heated fluid is blown to the heating target for heating the same, whereby solder is melted.


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