Company Filing History:
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1 out of 51 Years Active: 2025
Title: Innovations by Hideki Kyogoku
Introduction
Hideki Kyogoku is a notable inventor based in Hiroshima, Japan. He has made significant contributions to the field of materials science, particularly in the area of copper powder technology. His work focuses on enhancing the electrical conductivity of copper materials, which is crucial for various industrial applications.
Latest Patents
Kyogoku holds a patent for a method of laminating and shaping copper powder. This invention provides a laminating and shaping copper powder capable of producing a laminated and shaped object of copper with a high electrical conductivity of 80% IACS or more. The patent details a process that involves mixing a nano-oxide in a specific weight percentage with pure copper powder. This innovative approach not only improves the conductivity of the final product but also introduces a manufacturing method and apparatus for creating these laminated and shaped objects.
Career Highlights
Throughout his career, Hideki Kyogoku has worked with prominent companies in the field. He has been associated with Fukuda Metal Foil & Powder Co., Ltd. and the Technology Research Association for Future Additive Manufacturing. His expertise in materials science has allowed him to contribute to advancements in additive manufacturing techniques.
Collaborations
One of his notable collaborators is Yuji Sugitani. Their partnership has likely fostered innovative ideas and developments in the field of copper powder technology.
Conclusion
Hideki Kyogoku's contributions to the field of materials science, particularly through his patented innovations, highlight the importance of research and development in enhancing the properties of industrial materials. His work continues to influence advancements in manufacturing processes and applications.