The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 15, 2025

Filed:

Jun. 04, 2020
Applicants:

Fukuda Metal Foil & Powder Co., Ltd., Kyoto, JP;

Technology Research Association for Future Additive Manufacturing, Tokyo, JP;

Inventors:

Yuji Sugitani, Kyoto, JP;

Hideki Kyogoku, Hiroshima, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/342 (2014.01); B22F 1/00 (2022.01); B22F 1/05 (2022.01); B22F 1/105 (2022.01); B22F 1/12 (2022.01); B22F 10/28 (2021.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 70/00 (2020.01); B23K 103/12 (2006.01); B33Y 80/00 (2015.01);
U.S. Cl.
CPC ...
B23K 26/342 (2015.10); B22F 1/00 (2013.01); B22F 1/05 (2022.01); B22F 1/105 (2022.01); B22F 1/12 (2022.01); B22F 10/28 (2021.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 70/00 (2014.12); B22F 2301/10 (2013.01); B22F 2302/25 (2013.01); B22F 2304/10 (2013.01); B23K 2103/12 (2018.08); B33Y 80/00 (2014.12);
Abstract

The present invention provides a laminating and shaping copper powder capable of shaping a laminated and shaped object of copper having a high electrical conductivity of, for example, 80% IACS or more. The present invention is a laminating and shaping copper powder obtained by mixing a nano-oxide of equal to or more than 0.01 wt % and equal to or less than 0.20 wt % and a pure copper powder. There is also provided a laminated and shaped object using the laminating and shaping copper powder of the present invention. There are also provided a manufacturing method of the laminated and shaped object using the laminating and shaping copper powder of the present invention and a laminating and shaping apparatus using the laminating and shaping copper powder.


Find Patent Forward Citations

Loading…