This inventor holds 1 USPTO granted patent. Top assignee: Adeia Semiconductor Bonding Technologies Inc.. Active years: 2014.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2014
Title: The Innovative Contributions of Hideki Kotake
Introduction
Hideki Kotake is a prominent inventor based in Tokyo, Japan. He is known for his significant contributions to the field of semiconductor technology. His innovative work has led to the development of advanced interconnect elements that enhance the performance of electronic devices.
Latest Patents
Kotate holds a patent for a "Structure and method of making interconnect element having metal traces embedded in surface of dielectric." This invention provides a monolithic dielectric element with a first exposed major surface and a plurality of first recesses extending inwardly from this surface. The design includes a second exposed major surface, with second recesses extending inwardly as well. The invention features first and second metal interconnect patterns embedded in the respective recesses, along with non-hollow metal posts that extend through the dielectric element. This innovative structure improves the efficiency and reliability of interconnect elements in electronic applications. He has 1 patent to his name.
Career Highlights
Kotate is currently associated with Adeia Semiconductor Bonding Technologies Inc., where he continues to push the boundaries of semiconductor technology. His work has been instrumental in developing new methods and structures that enhance the functionality of electronic components.
Collaborations
Throughout his career, Kotake has collaborated with notable colleagues, including Toku Yoshino and Tomoo Iijima. These partnerships have fostered a creative environment that has led to groundbreaking advancements in their field.
Conclusion
Hideki Kotake's contributions to semiconductor technology exemplify the spirit of innovation. His patented work on interconnect elements showcases his expertise and commitment to advancing electronic device performance. His collaborations further highlight the importance of teamwork in achieving technological breakthroughs.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile