Adeia Semiconductor Bonding Technologies Inc.

Hideki Kotake

Tomoo Iijima

Yukio Hashimoto

Inetaro Kurosawa

Toku Yoshino

Kiyoshi Hyodo

An interconnect element is provided. A monolithic dielectric element has a first exposed major surface, a plurality of first recesses extending inwardly from the first major surface, and a second exposed major surface remote from the first major surface, a plurality of second recesses extending inwardly from the second major surface. A plurality of first metal interconnect patterns are embedded in the plurality of first recesses and extend in one or more directions along the first major surface. A plurality of second metal interconnect patterns are embedded in the plurality of second recesses and extend in one or more directions along the second major surface. A plurality of non-hollow metal posts extend through the dielectric element between at least some of the plurality of first metal interconnect patterns and at least some of the plurality of second metal interconnect patterns.

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Tokyo, Japan

Hideki Kotake