Hidekazu Nakamura

Title: The Innovations of Hidekazu Nakamura

Introduction

Hidekazu Nakamura is a prominent inventor based in Osaka, Japan. He has made significant contributions to the field of semiconductor technology. With a total of 3 patents to his name, Nakamura's work has had a lasting impact on the industry.

Latest Patents

One of his latest patents is a semiconductor device and method for manufacturing the same. This invention involves a surface mount-type semiconductor device that includes a nitride semiconductor chip. The chip features a silicon substrate with a specific thermal expansion coefficient and an InGaAlN layer in contact with the silicon surface. The design ensures that the die pad, made of copper, has a greater thermal expansion coefficient than the silicon substrate. The specifications include a minimum thickness of 0.2 mm for the nitride semiconductor chip and a length of at least 3.12 mm. Additionally, the relationship between the thickness of the die pad and the length of the nitride semiconductor chip is defined by a specific formula.

Career Highlights

Nakamura has worked with notable companies such as Panasonic Intellectual Property Management Co., Ltd. and Matsushita Electronics Corporation. His experience in these organizations has contributed to his expertise in semiconductor technology and innovation.

Collaborations

Some of his coworkers include Manabu Yanagihara and Tomohiko Nakamura. Their collaboration has likely fostered a creative environment that encourages innovation and development in their projects.

Conclusion

Hidekazu Nakamura's contributions to semiconductor technology through his patents and collaborations highlight his role as a key inventor in the field. His work continues to influence advancements in technology and innovation.