The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2000
Filed:
May. 11, 1998
Hideaki Nakura, Osaka, JP;
Isamu Kawashima, Shiga, JP;
Jutarou Kotani, Kyoto, JP;
Hidekazu Nakamura, Osaka, JP;
Matsushita Electronics Corporation, Osaka, JP;
Abstract
A semiconductor device provided with a wide and shallow first groove and a second groove in the first groove area, having a narrower width than that of the first groove around a predetermined area in a one-conductive area provided in the upper region of a semiconductor substrate as a mesa groove, wherein at least the second groove is covered with an electrical insulator. The upper surface of the electrical insulator is located approximately as high as or lower than the upper surface of the electrical insulating film. Thus, especially in a mesa semiconductor device with a high-voltage resistance, an insulating protective layer having a sufficient thickness can be formed stably over the entire region of a mesa groove. As a result, the variation in high-voltage resistance characteristics can be decreased and the processing yield affected by breakage or cracking in the mesa groove region during subsequent processes caused by the formation of the mesa groove can be improved greatly.