Hidehisa Hashizume

Title: Innovations of Hidehisa Hashizume

Introduction

Hidehisa Hashizume is a notable inventor based in Kobe, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 6 patents. His work primarily focuses on methods and devices for measuring the shapes of semiconductor wafers.

Latest Patents

One of his latest patents is a shape measurement method and shape measurement device. This invention involves a measurement unit that accurately measures the cross-sectional shape of the edge part of a semiconductor wafer, a support member, and a laminated wafer. The analysis unit calculates the thickness of an adhesive agent by subtracting the thicknesses of the semiconductor wafer and the support member from that of the laminated wafer. Another significant patent is a shape measurement apparatus and method that measures the end surface of a disk-shaped semiconductor wafer based on its projection image. This method effectively eliminates the influence of contaminants on the end surface, ensuring precise measurements.

Career Highlights

Throughout his career, Hidehisa Hashizume has worked with reputable organizations such as Kobelco Research Institute, Inc. and Leo Corporation. His expertise in semiconductor technology has allowed him to develop innovative solutions that enhance measurement accuracy in the industry.

Collaborations

He has collaborated with notable colleagues, including Yasuhide Nakai and Yutaka Kawata, contributing to advancements in semiconductor measurement technologies.

Conclusion

Hidehisa Hashizume's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the field. His innovative methods for shape measurement continue to impact the industry positively.