Fuchu, Japan

Hideaki Yoshida

This inventor holds 1 USPTO granted patent. Top assignee: Anelva Corporation. Active years: 1992.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hideaki Yoshida. Retrieved from https://idiyas.com/inventor/hideaki-yoshida-g9h5vi20

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 8(Granted Patents)


Company Filing History:


Years Active: 1992

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1 patent (USPTO):Explore Patents

Title: The Innovations of Hideaki Yoshida

Introduction

Hideaki Yoshida is a notable inventor based in Fuchu, Japan. He has made significant contributions to the field of thin film technology, particularly through his innovative patent related to magnetron sputtering apparatus.

Latest Patents

Yoshida holds a patent for a "Magnetron sputtering apparatus and thin film depositing method." This invention enhances the strength of the rotating magnetic field around the center area of a target during sputtering. The design aims to minimize dust particles that could settle on the target area and subsequently affect the quality of thin films deposited on wafers. The method ensures a thin film layer is formed with a distribution within ±5% of the calculated value, significantly improving step coverage for contact holes in individual substrates.

Career Highlights

Yoshida is associated with Anelva Corporation, where he has been instrumental in advancing thin film deposition technologies. His work has contributed to the development of more efficient and reliable sputtering methods, which are crucial in various applications, including semiconductor manufacturing.

Collaborations

Yoshida has collaborated with notable colleagues such as Haruyuki Kochi and Yasuhiko Akao. Their combined expertise has fostered innovation and progress within their field.

Conclusion

Hideaki Yoshida's contributions to magnetron sputtering technology exemplify the impact of innovative thinking in the realm of thin film deposition. His patent reflects a commitment to enhancing manufacturing processes and improving product quality.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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