Hideaki Ohkura

Title: Innovations of Hideaki Ohkura

Introduction

Hideaki Ohkura is a notable inventor based in Kanagawa, Japan. He has made significant contributions to the field of electronics, particularly through his innovative patents. With a total of 6 patents, Ohkura has established himself as a key figure in the development of advanced electronic materials.

Latest Patents

Ohkura's latest patents include an elastic conductive resin and an electronic device that incorporates elastic conductive bumps made from this resin. The electronic device features an electronic part with at least one first electrode and a substrate with at least one second electrode. The bumps, formed from a resin with rubbery elasticity and an acicular conductive filler, enable electrical connection between the electrodes through mechanical contact. Additionally, he has developed a method for forming a conductive pattern that involves printing on a liquid-repellent base material and creating an insulating layer over the conductive pattern.

Career Highlights

Throughout his career, Hideaki Ohkura has worked with prominent companies such as Ricoh Company, Ltd. and Hokushin Kogyo Kabushiki Kaisha. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.

Collaborations

Ohkura has collaborated with talented individuals in his field, including Takeshi Sano and Hirofumi Kobayashi. These partnerships have likely enhanced his work and led to further advancements in his inventions.

Conclusion

Hideaki Ohkura's contributions to the field of electronics through his patents and collaborations highlight his innovative spirit and dedication to advancing technology. His work continues to influence the development of electronic devices and materials.