The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2007
Filed:
Sep. 09, 2004
Takeshi Sano, Kanagawa, JP;
Yoshihiro Yoshida, Kanagawa, JP;
Hideaki Ohkura, Kanagawa, JP;
Hirofumi Kobayashi, Kanagawa, JP;
Takeshi Sano, Kanagawa, JP;
Yoshihiro Yoshida, Kanagawa, JP;
Hideaki Ohkura, Kanagawa, JP;
Hirofumi Kobayashi, Kanagawa, JP;
Ricoh Company, Ltd., Tokyo, JP;
Abstract
A disclosed bonded structure includes a first electric structure having a first electrode, a second electric structure having a second electrode, and a middle section for electrically and mechanically bonding the first electrode and the second electrode. The middle section consists of conductive adhesives, wherein fusion bonding of metal particles is provided to at least one of the first electrode and the second electrode. The metal particles are capable of fusion bonding at a temperature lower than a thermal hardening temperature of the conductive adhesives. The conductive adhesives contain conductive filler pieces that have a particle size at which fusion bonding does not take place at a temperature lower than the thermal hardening temperature of the conductive adhesives.