Ricoh Company, Ltd.

Hokushin Kogyo Kabushiki Kaisha

Honda Giken Kogyo Kabushiki Kaisha

Hideaki Ohkura

Takeshi Sano

Hirofumi Kobayashi

Yoshihiro Yoshida

Yasuo Miyamoto

Hiroshi Yoshida

Takefumi Toyoshima

Izumi Nishimura

Toshiyuki Oikawa

Tomio Iwabori

Kenji Sekijima

Makoto Ohashi

Kunio Ikeda

An electronic device includes an electronic part including at least one first electrode, a substrate including at least one second electrode, and at least one bump formed on the at least one first electrode and formed from an elastic conductive resin including a resin having rubbery elasticity, and an acicular conductive filler including a surface layer coated with one of gold, silver, nickel, and copper. The at least one first electrode and the at least one second electrode are electrically connected to each other by mechanically contacting the at least one bump with the at least one second electrode.

Elastic conductive resin, and electronic device including elastic conductive bumps made of the elastic conductive resin

The present invention discloses a method of forming a conductive pattern including the steps of a) printing a conductive pattern onto a surface of a base material having a liquid repellent property, b) providing a lyophilic property to a predetermined area of the surface of the base material which area does not have the conductive pattern printed thereon, and c) forming an insulating layer that covers the conductive pattern.

Method of forming conductive pattern

A wiring pattern-forming apparatus, includes a transfer platefor transferring a wiring materialarranged to form a wiring pattern onto a substrate, a wiring material feederfor feeding the wiring materialonto the transfer plate, and an energy feederto feed energy to the wiring materialfed to the transfer plateby the wiring material feeder. By utilizing the energy fed from the energy feeder, the viscosity of the wiring materialwhen the materialis fed from the material feederto the transfer plateis made different from that of the wiring materialwhen the materialis transferred from the transfer plateto the substrate

Apparatus and method for formation of a wiring pattern on a substrate, and electronic devices and producing methods thereof

A disclosed bonded structure includes a first electric structure having a first electrode, a second electric structure having a second electrode, and a middle section for electrically and mechanically bonding the first electrode and the second electrode. The middle section consists of conductive adhesives, wherein fusion bonding of metal particles is provided to at least one of the first electrode and the second electrode. The metal particles are capable of fusion bonding at a temperature lower than a thermal hardening temperature of the conductive adhesives. The conductive adhesives contain conductive filler pieces that have a particle size at which fusion bonding does not take place at a temperature lower than the thermal hardening temperature of the conductive adhesives.

Bonded structure using conductive adhesives, and a manufacturing method thereof

A fluid-sealed engine mounting has a connector adapted to be connected to an engine, a base adapted to be connected to a vehicle frame, an elastic member joined between the connector and the base and elastically deformable in response to vibrations transmitted thereto, the connector, the base, and the elastic member jointly defining a fluid chamber in which a fluid is sealed, and a partition dividing the fluid chamber into a first chamber adjacent to the connector and a second chamber adjacent to the base, the partition having an orifice through which the first and second chambers communicate with each other. The engine mounting also includes a diaphragm mounted on the base or the connector for varying the volume of one of the first and second chambers when vibrations are transmitted to the engine mounting.

Fluid-sealed engine mounting

A fluid-sealed engine mounting has a connector adapted to be connected to an engine, a base adapted to be connected to a vehicle frame, an elastic member joined between the connector and the base and elastically deformable in response to vibrations transmitted thereto, the connector, the base, and the elastic member jointly defining a fluid chamber in which a fluid is sealed, and a partition dividing the fluid member into a first chamber adjacent to the connector and a second chamber adjacent to the base, the partition having an orifice through which the first and second chambers communicate with each other. The engine mounting also includes a diaphragm mounted on the base or the connector for varying the volume of one of the first and second chambers when vibrations are transmitted to the engine mounting.

Growing community of inventors

Kanagawa, Japan

Hideaki Ohkura