This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignee: Samsung Electro-Mechanics Co., Ltd.. Active years: 2012.
Location History:
- Chungcheongnam-do, KR (2012)
- Suwon-si, KR (2012)
Company Filing History:
Years Active: 2012
Title: Heung Jae Oh: Innovator in Package Substrate Technology
Introduction
Heung Jae Oh is a notable inventor based in Chungcheongnam-do, South Korea. He has made significant contributions to the field of package substrate technology, holding 2 patents that showcase his innovative spirit and technical expertise.
Latest Patents
His latest patents include a lead pin for package substrate and a method for manufacturing package substrate with the same. The lead pin for the package substrate features a head part with a concave depression toward the package substrate, enhancing its functionality. Additionally, the design includes a cylindrical connection pin and a head part with a convex round part, which prevents the bulge phenomenon of solder paste during the mounting process. This innovation aims to improve contact defects and ensure a cleaner connection when coupling a socket.
Career Highlights
Heung Jae Oh is currently employed at Samsung Electro-Mechanics Co., Ltd., where he continues to develop cutting-edge technologies in the electronics sector. His work has been instrumental in advancing the efficiency and reliability of package substrates.
Collaborations
He has collaborated with notable colleagues such as Ki Taek Lee and Jin Won Choi, contributing to a dynamic team focused on innovation and excellence in their field.
Conclusion
Heung Jae Oh's contributions to package substrate technology reflect his dedication to innovation and his role as a key player in the electronics industry. His patents not only enhance product performance but also pave the way for future advancements in technology.