The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2012
Filed:
Jul. 19, 2010
Heung Jae OH, Suwon-si, KR;
Ki Taek Lee, Seoul, KR;
Dong Gyu Lee, Suwon-si, KR;
Sung Won Jeong, Yongin-si, KR;
Jin Won Choi, Yongin-si, KR;
Heung Jae Oh, Suwon-si, KR;
Ki Taek Lee, Seoul, KR;
Dong Gyu Lee, Suwon-si, KR;
Sung Won Jeong, Yongin-si, KR;
Jin Won Choi, Yongin-si, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Abstract
Disclosed herein is a lead pin for a package substrate. The lead pin for the package substrate includes a cylindrical connection pin; and a head part that is formed on one end of the connection pin and has a convex round part formed on the lower end of the head part, having a step part. When the lead pin for the package substrate is mounted on the package substrate, the bulge phenomenon of a solder paste that surrounds the head part and is melted is prevented by a flange part, thereby making it possible to prevent the connection pin from being polluted and to improve a contact defect such as a short defect or the like when coupling a socket.