Samsung Electro-mechanics Co., Ltd.

Heung Jae Oh

Jin Won Choi

Ki Taek Lee

Dong Gyu Lee

Sung Won Jeong

Disclosed herein is a lead pin for a package substrate. The lead pin for the package substrate according to the exemplary embodiment of the present invention includes a head part having one surface opposite to the package substrate and the other surface that is an opposite side to the one surface; and a connection pin having a pin shape bonded to the other surface of the head part, wherein the head part has a concave depression part toward the package substrate.

Lead pin for package substrate, and method for manufacturing package substrate with the same

Disclosed herein is a lead pin for a package substrate. The lead pin for the package substrate includes a cylindrical connection pin; and a head part that is formed on one end of the connection pin and has a convex round part formed on the lower end of the head part, having a step part. When the lead pin for the package substrate is mounted on the package substrate, the bulge phenomenon of a solder paste that surrounds the head part and is melted is prevented by a flange part, thereby making it possible to prevent the connection pin from being polluted and to improve a contact defect such as a short defect or the like when coupling a socket.

Growing community of inventors

Chungcheongnam-do, South Korea

Heung Jae Oh