Herong Lei

Title: Herong Lei: Innovator in Electrical Laminates

Introduction

Herong Lei is a notable inventor based in Acton, MA (US), recognized for his contributions to the field of electrical laminates. With a total of two patents to his name, he has made significant advancements in manufacturing techniques that enhance the performance and reliability of printed wire boards.

Latest Patents

Herong Lei's latest patents include innovative methods for manufacturing printed wire boards. One of his key inventions involves a method of forming vias in electrical laminates. This method comprises laminating a sheet with a crosslinkable polymer composition to a substrate, where the composition has a specific viscosity range at lamination temperatures. The process includes forming vias through laser ablation and thermally curing the polymer layer afterward. This technique yields excellent lamination results, via profiles, and desmear outcomes. Another patent focuses on polyarylene polymers, which utilize compositions of arylene oligomers and curing agents to create arylene polymer coatings with enhanced mechanical properties when cured in an oxygen-rich environment.

Career Highlights

Throughout his career, Herong Lei has worked with prominent companies in the electronics materials sector. He has been associated with Rohm and Haas Electronic Materials LLC and Rohm and Haas Electronic Materials Korea Ltd., where he contributed to the development of advanced materials for electronic applications.

Collaborations

Herong Lei has collaborated with several professionals in his field, including notable coworkers such as Tina Aoude and David Fleming. Their collective expertise has likely contributed to the success of his innovative projects.

Conclusion

Herong Lei's work in the field of electrical laminates showcases his commitment to innovation and excellence. His patents reflect a deep understanding of material science and manufacturing processes, making him a valuable contributor to the industry.