The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2022
Filed:
Mar. 10, 2020
Rohm and Haas Electronic Materials Llc, Marlborough, MA (US);
Tina Aoude, Medway, MA (US);
David Fleming, Northborough, MA (US);
Michelle Bowerman Riener, Waltham, MA (US);
Colin O'Mara Hayes, Hudson, MA (US);
Herong Lei, Acton, MA (US);
Robert K. Barr, Shrewsbury, MA (US);
David Louis Danza, Rutland, MA (US);
ROHM AND HAAS ELECTRONIC MATERIALS LLC, Marlborough, MA (US);
Abstract
Disclosed herein is a method of forming vias in electrical laminates comprising laminating a sheet having a layer comprising a crosslinkable polymer composition to a substrate wherein the crosslinkable polymer composition has a viscosity at lamination temperatures in the range of 200 Pa-s to 100,000 Pa-s, forming at least one via in the crosslinkable polymer layer by laser ablation; and after the forming of the at least one via, thermally curing the crosslinkable polymer layer. According to certain embodiments the cross linkable polymer composition has a viscosity at lamination temperature of at least 5000 Pa-s. This method yields good lamination results, good via profiles, and good desmear results when such compositions are used and the via is laser ablated before cure.