Colin O'Mara Hayes

Title: Colin O'Mara Hayes: Innovator in Printed Wire Board Manufacturing

Introduction

Colin O'Mara Hayes is a notable inventor based in Hudson, MA (US). He has made significant contributions to the field of electrical laminates, particularly in the manufacturing of printed wire boards. His innovative methods have the potential to enhance the efficiency and quality of electronic components.

Latest Patents

Colin O'Mara Hayes holds a patent for "Methods of manufacturing printed wire boards." This patent discloses a method of forming vias in electrical laminates. The process involves laminating a sheet with a crosslinkable polymer composition to a substrate. The crosslinkable polymer composition has a viscosity at lamination temperatures ranging from 200 Pa-s to 100,000 Pa-s. The method includes forming at least one via in the crosslinkable polymer layer through laser ablation, followed by thermally curing the polymer layer. This innovative approach yields excellent lamination results, via profiles, and desmear results when the via is laser ablated before curing.

Career Highlights

Colin O'Mara Hayes is currently employed at Rohm & Haas Electronic Materials LLC, where he continues to develop and refine his innovative techniques. His work has been instrumental in advancing the manufacturing processes within the electronics industry.

Collaborations

Colin has collaborated with talented coworkers, including Tina Aoude and David Fleming, who contribute to the innovative environment at Rohm & Haas Electronic Materials LLC.

Conclusion

Colin O'Mara Hayes is a distinguished inventor whose work in printed wire board manufacturing showcases his commitment to innovation and excellence. His patented methods are set to make a significant impact in the electronics field.