Munich, Germany

Herbert Zidek



Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 122(Granted Patents)


Company Filing History:


Years Active: 2006

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1 patent (USPTO):Explore Patents

Title: The Innovative Mind of Herbert Zidek

Introduction

Herbert Zidek, an inventive professional based in Munich, Germany, has made a significant contribution to the field of electronics with his innovative approach to heat dissipation in encapsulated devices. With one patent to his name, Zidek has exhibited his skill and expertise in developing cutting-edge technologies that enhance the performance and longevity of electronic components.

Latest Patents

Zidek's patent, titled "Encapsulated electronics device with improved heat dissipation," presents a novel method aimed at enhancing heat dissipation within chip-sized surface acoustic wave (SAW) packages. This innovative package consists of one or more acoustic-wave components crafted on a die, positioned on an electrically non-conductive carrier separated by electrically conductive bumps. The top of the package is protected by a laminate and a hermetic seal layer. Zidek's method improves heat dissipation by removing part of the laminate and adding a layer of thermal conducting material on the package, as well as creating one or more heat conducting paths through the carrier.

Career Highlights

Throughout his career, Herbert Zidek has worked with prominent companies such as Nokia Corporation and Epcos AG, where he has honed his skills and expanded his knowledge in the field of electronics. His experiences within these organizations have equipped him with the expertise necessary to tackle complex challenges in electronic device design and manufacturing.

Collaborations

Zidek has had the opportunity to collaborate with esteemed colleagues, including Pasi Tikka and Edgar Schmidhammer. These professional relationships have undoubtedly influenced his innovative work and contributed to his success within the industry.

Conclusion

Herbert Zidek's contributions to the field of encapsulated electronics demonstrate his dedication to innovation and improvement in technology. With a focus on enhancing heat dissipation in electronic devices, Zidek stands as a respected inventor whose work will likely benefit the industry for years to come.

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