The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2006
Filed:
Jan. 30, 2004
Pasi Tikka, München, DE;
Edgar Schmidhammer, Stein, DE;
Habbo Heinze, Unterschleissheim, DE;
Reiner Welzer, München, DE;
Herbert Zidek, Munich, DE;
Ansgar Schäufele, Munich, DE;
Juha Ellä, Halikko, FI;
Pasi Tikka, München, DE;
Edgar Schmidhammer, Stein, DE;
Habbo Heinze, Unterschleissheim, DE;
Reiner Welzer, München, DE;
Herbert Zidek, Munich, DE;
Ansgar Schäufele, Munich, DE;
Juha Ellä, Halikko, FI;
Nokia Corporation, Espoo, FI;
Epcos AG, Munich, DE;
Abstract
A method for improving heat dissipation in an encapsulated electronic package usually referred to as a chip-size SAW package. The package comprises one or more acoustic-wave components fabricated on a die, which is disposed on an electrically non-conductive carrier separated by electrically conducting bumps. The top of the package is covered by a laminate and a hermetic seal layer. Heat dissipation can be improved by removing a part of the laminate and then depositing a layer of thermal conducting material on the package, and by providing one or more heat conducting paths through the carrier.