Nokia Corporation

Epcos Ag

Herbert Zidek

Edgar Schmidhammer

Pasi Tikka

Juha Ellä

Habbo Heinze

Ansgar Schäufele

Reiner Welzer

Ansgar Schaufele

Juha EllÄ

A method for improving heat dissipation in an encapsulated electronic package usually referred to as a chip-size SAW package. The package comprises one or more acoustic-wave components fabricated on a die, which is disposed on an electrically non-conductive carrier separated by electrically conducting bumps. The top of the package is covered by a laminate and a hermetic seal layer. Heat dissipation can be improved by removing a part of the laminate and then depositing a layer of thermal conducting material on the package, and by providing one or more heat conducting paths through the carrier.

Encapsulated electronics device with improved heat dissipation

Growing community of inventors

Munich, Germany

Herbert Zidek