Herbert Wayne Owens, Jr

Title: Herbert Wayne Owens, Jr.: Innovator in Polishing Technology

Introduction

Herbert Wayne Owens, Jr. is a notable inventor based in San Jose, CA, recognized for his contributions to the field of polishing technology. With a focus on enhancing the efficiency of semiconductor wafer processing, Owens has developed innovative solutions that streamline manufacturing processes.

Latest Patents

Owens holds a patent for a polishing machine and method, which is designed to polish work pieces such as semiconductor wafers. The apparatus features a variable number of independent heads, platens, and polishing units. This unique polishing apparatus allows wafers to remain attached to the same heads throughout all polishing steps, eliminating the need for undesirable reloading between steps. Each independent head can be automatically coupled to and decoupled from any polishing unit, optimizing throughput and providing flexibility for different polishing processes. The head transfer subsystem enables independent transfer for each head, allowing for multiple overlapping polishing cycles on various wafers, thus maximizing processing throughput. He has 1 patent to his name.

Career Highlights

Owens has made significant strides in his career, particularly through his work at Accretech USA, Inc. His innovative approach to polishing technology has positioned him as a key player in the semiconductor manufacturing industry.

Collaborations

Throughout his career, Owens has collaborated with talented individuals such as Edmond Arzumau Abrahamians and Igor Kravtsov, contributing to advancements in polishing technology.

Conclusion

Herbert Wayne Owens, Jr. stands out as an influential inventor in the realm of polishing technology, with a focus on improving semiconductor wafer processing. His innovative patent and contributions to Accretech USA, Inc. highlight his commitment to advancing manufacturing efficiency.