Cheonan-si, South Korea

Heonwoo Kim

USPTO Granted Patents = 4 

Average Co-Inventor Count = 2.3

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2023-2025

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4 patents (USPTO):Explore Patents

Title: Heonwoo Kim: A Pioneer in Semiconductor Innovations

Introduction

Heonwoo Kim is an accomplished inventor based in Cheonan-si, South Korea. With a remarkable portfolio of four patents, he has significantly contributed to the field of semiconductor technology. His work at Samsung Electronics has positioned him as a key player in the advancement of electronic components.

Latest Patents

Among his noteworthy inventions, Heonwoo Kim has developed a novel semiconductor package that features an interposer substrate integrated with a package substrate. This innovative design includes an upper pad and a lower pad linked by a redistribution structure that facilitates seamless connections for semiconductor chips. Additionally, he has created a sophisticated semiconductor device that employs an interposer with distinct central and edge regions, incorporating advanced wiring and metal structures to support multiple semiconductor chips.

Career Highlights

Heonwoo's career has been marked by his commitment to enhancing semiconductor technologies, which is evident in his successful patent applications. His expertise not only contributes to the growth of Samsung Electronics but also influences the broader landscape of electronic innovation.

Collaborations

Throughout his career, Heonwoo Kim has collaborated with esteemed colleagues, including Sangcheon Park and Sungwoo Park. These partnerships reflect the importance of teamwork in driving forward the complexities of semiconductor research and development.

Conclusion

With his impressive array of patents and collaborative spirit, Heonwoo Kim continues to pave the way for future innovations in the semiconductor industry. His contributions are vital to the ongoing evolution of technology, showcasing the pivotal role of inventors in shaping our digital world.

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