The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 10, 2025
Filed:
Jun. 13, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
Sangcheon Park, Hwaseong-si, KR;
Heonwoo Kim, Cheonan-si, KR;
Sungwoo Park, Seongnam-si, KR;
Chajea Jo, Suwon-si, KR;
Abstract
A semiconductor package includes an interposer substrate on a package substrate. The interposer substrate includes an upper pad on an upper surface of the insulating layer, a lower pad on a lower surface of the insulating layer, and a redistribution structure penetrating the insulating layer between the upper surface and the lower surface to connect the upper pad and the lower pad. A semiconductor chip is disposed above the interposer substrate and connected to the upper pad, and a connection bump directly contacts a lower surface of the lower pad. The redistribution structure includes redistribution layers and redistribution vias connected to the redistribution layers, wherein each of the redistribution layers and each of the redistribution vias includes a metal material layer and a plating seed layer, and the lower pad directly contacts the plating seed layer.