This inventor holds 2 USPTO granted patents and 1 EPO patent. Top assignees: Senju Metal Industry Co., Ltd., Senju Metal Industry Co., Ltd.. Active years: 2025-2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
1 out of 338 
1 out of 13 Years Active: 2025-2026
Title: Innovations of Henri Hanzawa
Introduction
Henri Hanzawa is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of soldering technology. His innovative approach has led to the development of a unique solder removing mechanism.
Latest Patents
Henri Hanzawa holds a patent for a soldering apparatus. This apparatus features a solder removing mechanism designed to efficiently remove solder from conveyance claws that are used for conveying substrates. The mechanism includes an abutment body that can pass through the recesses of the conveyance claws or operate below them.
Career Highlights
Hanzawa is associated with Senju Metal Industry Co., Ltd., a company known for its advancements in soldering technology. His work has contributed to improving the efficiency and effectiveness of soldering processes in various applications.
Collaborations
Henri Hanzawa has collaborated with notable colleagues, including Yasuji Kawashima and Hiroshi Taguchi. Their combined expertise has fostered innovation within their projects.
Conclusion
Henri Hanzawa's contributions to soldering technology exemplify the impact of innovative thinking in engineering. His patent for a soldering apparatus showcases his commitment to enhancing manufacturing processes.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile