The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2026
Filed:
Jun. 12, 2023
Applicant:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Inventors:
Yasuji Kawashima, Tokyo, JP;
Hiroshi Taguchi, Tokyo, JP;
Kyoko Kuramoto, Tokyo, JP;
Henri Hanzawa, Tokyo, JP;
Tomotake Kagaya, Tokyo, JP;
Hirokazu Ichikawa, Tokyo, JP;
Katsuhiro Shinohara, Tokyo, JP;
Assignee:
SENJU METAL INDUSTRY CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 3/08 (2006.01); B23K 3/06 (2006.01);
U.S. Cl.
CPC ...
B23K 3/085 (2013.01); B23K 3/0638 (2013.01);
Abstract
A jet soldering apparatushas a storage tankconfigured to store molten solder; a supply portfor supplying the molten solder to a substrate; and a cooling unitthat is positioned on a downstream side of the supply portin a conveyance direction of the substrate, is provided at an upper position of the storage tank, and is configured to supply gas.