This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Senju Metal Industry Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Hirokazu Ichikawa: Inventor of a Jet Soldering Apparatus.
Introduction
Hirokazu Ichikawa is an inventor based in Tokyo, Japan, whose patent work includes an apparatus for soldering electronic substrates.
Latest Patents
Ichikawa is associated with 1 patent, titled “Jet Soldering Apparatus.” The invention includes a storage tank for molten solder, a supply port that delivers solder to a substrate, and a cooling unit positioned downstream of the supply port along the substrate’s conveyance direction. Located above the storage tank, the cooling unit supplies gas.
Career Highlights
Ichikawa works at Senju Metal Industry Co., Ltd. His patented apparatus addresses solder delivery and cooling within a substrate conveyance process.
Collaborations
His listed coworkers include Hiroshi Taguchi and Henri Hanzawa.
Conclusion
Hirokazu Ichikawa’s patent reflects his work on soldering equipment, particularly the coordinated supply and cooling of molten solder during substrate processing.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile