Pingzhen, Taiwan

Heng Kai Liu

This inventor holds 3 USPTO granted patents. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2014-2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Heng Kai Liu. Retrieved from https://idiyas.com/inventor/heng-kai-liu-opxcihya

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 66.7

Average Co-Inventor Count = 4.7

ph-index = 2

Forward Citations = 13(Granted Patents)


Company Filing History:


Years Active: 2014-2016

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3 patents (USPTO):Explore Patents

Title: **Innovator Heng Kai Liu: Pioneering Developments in 3D Integrated Circuits**

Introduction

Heng Kai Liu, an accomplished inventor based in Pingzhen, Taiwan, has made significant contributions to the field of integrated circuits. With three patented innovations to his name, Liu stands out in the technologically advanced landscape of semiconductor manufacturing.

Latest Patents

Liu's most recent patents focus on a partitioning method and system for three-dimensional integrated circuits (3D ICs). These methods involve receiving a circuit design containing networks of devices fabricated by a specific process. Liu's innovative approach includes selecting second devices to be fabricated by a different process and substituting them for first devices in the design networks. By sorting these second devices based on their area, he efficiently assigns them to tiers within a 3D IC, optimizing space and performance. This method not only enhances the efficiency of IC designs but also plays a crucial role in advancing the compactness and functionality of semiconductor technologies.

Career Highlights

Liu currently works at Taiwan Semiconductor Manufacturing Company Ltd., a leading entity in the field of semiconductor manufacturing. His expertise in integrated circuits and innovative designs contributes to the company's reputation for excellence in technology and production.

Collaborations

Throughout his career, Liu has collaborated with notable colleagues, including Yi-Ting Lin and Hui Yu Lee. These partnerships have facilitated a dynamic exchange of ideas, fostering an environment that nurtures innovation and enhances the development process of cutting-edge technologies.

Conclusion

Heng Kai Liu's work in partitioning methods for 3D ICs exemplifies the spirit of innovation in the semiconductor industry. His contributions at Taiwan Semiconductor Manufacturing Company Ltd. are shaping the future of integrated circuit design, positioning him as a significant figure in the field. As technology continues to evolve, Liu’s advancements will undoubtedly play a pivotal role in the development of more efficient and powerful electronic systems.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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