The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9514261 B1

PDF
Full Text
Expired
Date of Patent:
Dec. 06, 2016

Filed:

Jan. 30, 2015
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Heng Kai Liu, Pingzhen, TW;

Hui Yu Lee, Hsin-Chu, TW;

Ya Yun Liu, Jhubei, TW;

Yi-Ting Lin, Hsinchu, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
G06F 17/5072 (2013.01);
Abstract

A method comprises: receiving a circuit design comprising networks of first devices fabricated by a first fabrication process; selecting second devices to be fabricated by a second process; substituting the second devices for the first devices in the networks of the circuit design; sorting the second devices within a selected one of the networks by device area from a largest device area to a smallest device area; and assigning each second device in the selected network to be fabricated in a respective tier of a plurality of tiers of a three dimensional integrated circuit (3D IC) for which a total area of second devices previously assigned to said respective tier is the smallest, the second devices being assigned sequentially according to the sorting.


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